| Resin-packaging Method of Low Cost and High Yield for Large Scale Packaging on Substrates |
| patented technology |
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| About the invention patent |
| The present invention relates to a packaging method using resin to package bare chips or semiconductor components on organic substrates and composite dielectric substrates. The method is suitable for large scale, low cost and high yield packaging and is used in the packaging of electronic components, particularly in MCM and SIP packaging that widely used in communications, radar, navigation and home appliances. The present invention has conquered the difficulty that the conventional organic and composite dielectric substrates are prone to deform or split when being heated and can replace the expensive ceramic substrates widely used nowadays. |
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| Technological innovations |
 The present invention has conquered the difficulty that the conventional organic and composite dielectric substrates are
prone to deform or split. After high-temperature molding of the components packaged, the resin will not split or deviate
from, but tightly attach to the substrates with different CTEs. |
The resin will tightly attach to the organic substrates or composite dielectric substrates even though the CTEs of the resin
are quite different from the substrates. |
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| Competitive edge & commercial values |
It conquers the difficulty that the conventional organic and composite dielectric substrates are prone to deform or split
when being heated. It provides very potential application value and market outlook for the packaging using resin of
semiconductors on organic substrates and composite substrates that are prone to deform when being heated. |
It is particularly suitable for MCM and SIP packaging widely used nowadays. Expensive ceramic substrates of which the
fabrication process is complex are mostly used when MCM and SIP packaging are for HF applications. The present
invention uses organic substrates and composite dielectric substrates having HF characteristics to manufacture a new
generation microwave semiconductor products having advantages of low cost, high yield and good RF characteristics to
replace those semiconductors packaged using resin on ceramic substrates. |
| It is suitable for large scale packaging using resin |
| It is suitable for cost-effective and high yield packaging using resin. |
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| The below RF microwave semiconductor products can be packaged when the present invention is used: |
| Power amplifier |
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| LNA |
| Preamplifier |
| Downconverter |
| High-density MCM modules |
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