CVD Diamond Chip Terminations offer a unique combination of extreme high power ratings in very small packages. These terminatio may be used in applications up to 30 GHz and are ideal for applications with requirements for high power capability, broad frequency response, small footprint and light weight. The terminations are manufactured using all thin film construction and have a gold finish that it both wire bondable and solderable. This total thin film construction also makes them ideal for peak power applications. High reliability tested versions based on MIL-PRF-55342 are also available. Select from tape and eel, bulk, or waffle packaging. These products are also lead free, RoHS compliant and S-level approved.