Yantel Corporation

Catalog

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High Power Gold Wire Bonding
1. Very Low Loss
2. High Directivity
3. High Return Loss
4. Gold Wire Bonding Package
Step Variable Attenuator(DIP)
1. VAD Series
2. Step variable
3. Low VSWR
4. Low ion loss
Fixed Attenuator Chip
1. Laser trimmed
2. High attenuation accuracy
3. Low VSWR
LTCC 3dB 90° Hybrid Coupler
1. Low profile, high performance 3dB hybrid coupler
2. Surface mount package
3. Low ion loss and tight amplitude and phase balance is required
4. LTCC process
Low Pass Filter
1. Small size
2. Low loss,High rejection
3. With shielding cover
4. SMD surface mounted
5. Huity level:MSL1
6. Working temperature:-55 to +125℃
7. Characteristic Impedance:50Ω
8. Tape package
9. Competitive price and suitable for large volume use
LTCC Low Pass Filter
1. Multilayer monolithic construction yields high reliability
2. Low ion loss and small size SMD chip design
3. Can simplify your complex tuning and circuit design
4. LTCC process
Band Pass Filter
1. Small size
2. Low loss,High rejection
3. With shielding cover
4. SMD surface mounted
5. Huity level:MSL1
6. Working temperature:-55 to +125℃
7. Characteristic Impedance:50Ω
8. Tape package
9. Competitive price and suitable for large volume use
LTCC Band Pass Filter
1. Multilayer monolithic construction yields high reliability
2. Low ion loss and small size SMD chip design
3. Can simplify your complex tuning and circuit design
4. LTCC process
High Pass Filter
1. Small size
2. Low loss,High rejection
3. With shielding cover
4. SMD surface mounted
5. Huity level:MSL1
6. Working temperature:-55 to +125℃
7. Characteristic Impedance:50Ω
8. Tape package
9. Competitive price and suitable for large volume use
LTCC High Pass Filter
1. Multilayer monolithic construction yields high reliability
2. Low ion loss and small size SMD chip design
3. Can simplify your complex tuning and circuit design
4. LTCC process

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