Low cost dispensing method for small chips

The present invention patent relates to packaging methods using fluid resin. The fluid resin dispensing and packaging method of the present invention is suitable for packaging of bare semiconductor chips on a variety of module substrates and is characterized by low cost, high speed, efficiency, safety and reliability, and high esthetic appeal and regularity. It has wide applications and high commercial value, particularly suitable for mass production of semiconductor modules.

It saves the barrier fabrication process required in conventional dispensing a fluid resin and for packaging therewith, reduces the area of the package to be occupied and greatly saves the time to package each semiconductor chip.

Utilizing the necessary procedure of applying solder mask during the process of fabricating substrates, the solder mask is used to cover the peripheral boundary of the object to be packaged. A barrier serving to prevent the liquid resin from overflowing is formed by utilizing surface tension between the fluid resin and the solder mask. With the aid of the fluid resin barrier, the dispensed fluid resin can be contained within the range of the design. A clean and neat resin-packaged substrate can be obtained after the resin is solidified by heating the substrate.

The solder will flow outwardly because of over temperature or the self-heating of the working semiconductor. It might cause short circuit of the adjacent pins which are not connected by the same circuit. The solder can be led to secure area through the solder-escaping plate, thus it can prevent the false short circuit inside the chip or other failures that will damage semiconductor components.

The solder ink will become inflated or gasified because of over temperature or the self-heating of the working semiconductor, which might cause the blast of the fluid resin. The solder ink-escaping space provides escaping space for the inflated and gasified solder ink, preventing the fluid resin from blasting due to over temperature, thus the failure rate is decreased and the reliability of the module is enhanced.