Yantel Corporation

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High Power Gold Wire Bonding
1. Very Low Loss
2. High Directivity
3. High Return Loss
4. Gold Wire Bonding Package
Step Variable Attenuator(DIP)
1. VAD Series
2. Step variable
3. Low VSWR
4. Low ion loss
Fixed Attenuator Chip
1. Laser trimmed
2. High attenuation accuracy
3. Low VSWR
Ceramic 3dB 90° Hybrid Coupler
1. Multilayer monolithic construction yields high reliability
2. Low ion loss and small size SMD chip design
3. Can simplify your complex tuning and circuit design
4. LTCC process
Ceramic Low Pass Filter
1. Multilayer monolithic construction yields high reliability
2. Low ion loss and small size SMD chip design
3. Can simplify your complex tuning and circuit design
4. LTCC process
Ceramic Band Pass Filter
1. Multilayer monolithic construction yields high reliability
2. Low ion loss and small size SMD chip design
3. Can simplify your complex tuning and circuit design
4. LTCC process
Ceramic High Pass Filter
1. Multilayer monolithic construction yields high reliability
2. Low ion loss and small size SMD chip design
3. Can simplify your complex tuning and circuit design
4. LTCC process
Ceramic Filter Combination
1. Multilayer monolithic construction yields high reliability
2. Low ion loss and small size SMD chip design
3. Can simplify your complex tuning and circuit design
4. LTCC process
Ceramic Duplexer
1. Multilayer monolithic construction yields high reliability
2. Low ion loss and small size SMD chip design
3. Can simplify your complex tuning and circuit design
4. LTCC process
Ceramic Antenna
1. Compact size
2. Omni-directional Radiation
3. Reflow process compatible
4. RoHS compliant
5. LTCC process

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