Yantel Corporation

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High Power Gold Wire Bonding
1. Very Low Loss
2. High Directivity
3. High Return Loss
4. Gold Wire Bonding Package
Fixed Attenuator Chip
1. Laser trimmed
2. High attenuation accuracy
3. Low VSWR
Fixed attenuator IC and Die
1. Adopting advance GaAs technology
2. Excellent attenuation accuracy & phase balance
3. High ESD level
4. Low VSWR
5. Die Package
Phase Shifters
1. Adopting International advanced GaAs technology
2. Low VSWR
3. Low Insertion loss
4. Die Package
Microwave Wideband 2 way/4way 0° Power Divider
1. Broad Band 6 to 32 GHz Performancel
2. 0.7 dB Typical Insertion Lossl
3. 20dB Typical Isolation and Return Lossl
4. Excellent Phase and Amplitude Balancel
5. Compact Solder Surface Mount Package
Diamond Termination
1. small size, light weight
2. highest thermal performance possible
3. excellent peak power capability
4. rugged passivated TaN film
5. moisture resistant
6. Pure gold input pads
7. wire bondable or solderable
8. high power
Variable attenuator IC
1. Adopting advance GaAs technology
2. Excellent attenuation accuracy & phase balance
3. High ESD level
4. Low VSWR
5. Die Package
Gain Equalizers
1. Adopting International advanced GaAs technology
2. Low VSWR
3. Large range of equilibrium
4. Die Package
PTFE Quadrifiler Coupler/Quadrifiler Phase Shifter/Four-arm Spiral Antenna
1. Small size: 5.08x3.18(mm)
2. Excellent phase and amplitude balance
3. Good repeatability
Microwave Wideband 3dB 90° Hybrid Coupler
1. Small Size
2. 90° Phase Delta between Output Ports
3. 30W Power Handling
4. Moisture Sensitivity Level: MSL1
5. Operating & Storage Temp: -55˚C to +125˚C

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