Yantel Corporation

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Fixed attenuator IC and Die
1. Adopting advance GaAs technology
2. Excellent attenuation accuracy & phase balance
3. High ESD level
4. Low VSWR
5. Die Package
Phase Shifters
1. Adopting International advanced GaAs technology
2. Low VSWR
3. Low Insertion loss
4. Die Package
Gain Equalizers
1. Adopting International advanced GaAs technology
2. Low VSWR
3. Large range of equilibrium
4. DNF2*2 \ QNF3*3 Package
LTCC 4-Way Power Splitter
1. Multilayer monolithic construction yields high reliability
2. Low ion loss and small size SMD chip design
3. Can simplify your complex tuning and circuit design
4. LTCC process
Microwave Wideband 2 way/4way 0° Power Divider
1. Broad Band 6 to 32 GHz Performancel
2. 0.7 dB Typical Insertion Lossl
3. 20dB Typical Isolation and Return Lossl
4. Excellent Phase and Amplitude Balancel
5. Compact Solder Surface Mount Package
Diamond Termination
1. small size, light weight
2. highest thermal performance possible
3. excellent peak power capability
4. rugged passivated TaN film
5. moisture resistant
6. Pure gold input pads
7. wire bondable or solderable
8. high power
Variable attenuator IC
1. Adopting advance GaAs technology
2. Excellent attenuation accuracy & phase balance
3. High ESD level
4. Low VSWR
5. Die Package
Gain Equalizers
1. Adopting International advanced GaAs technology
2. Low VSWR
3. Large range of equilibrium
4. Die Package
Power Divider Winding SMD
1. very wideband
2. very good phase unbalance
3. excellent amplitude unbalance
4. rugged shielded case
5. small size
6. pin to pin
7. winding SMD package
Balun IC
1. excellent RF performance
2. small size
3. very low loss

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